Precision 3c solution

ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials

Short Description:

Laser micromachining of ceramics, sapphire, diamond and calcium steel, high hardness & high brittleness plane and regular curved instruments


Product Detail

Technical Parameters

Maximum operating speed 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
Positioning accuracy ±3um (X) ±3um (Y1&Y2) ;±5um (Z);
Repetitive positioning accuracy ±lum (X) ;±lum(Y1&Y2) ;±3um(Z);
Machining material Alumina & zirconia & aluminum nitride & silicon nitride & Diamond &
Sapphire & Silicon & gallium arsenide & tungsten steel, etc;
Material wall thickness 0~2.0±0.02mm;
Plane machining range 300mm*300mm;(support customization for larger format requirements)
Laser type Fiber laser;
Laser wavelength 1030-1070±10nm;
laser power CW1000W&QCW150W& QCW300W& QCW450W for option
Equipment power supply 220V± 10%, 50Hz;AC 20A (main circuit breaker);
File format DXF、DWG;
Equipment dimensions 1280mm*1320mm*1600mm;
Equipment weight 1500Kg;

Sample Exhibition

ECLC6045-2Application scope

օ Laser micromachining of ceramics, sapphire, diamond and calcium steel, high hardness & high brittleness plane and regular curved instruments

High precision machining

օ Small cutting seam width: 15 ~ 30um

օ High machining accuracy: ≤ ± 10um

օ Good quality of incision: smooth incision, small heat affected zone, less burr and edge chipping < 15um

օ Size refinement: the minimum product size is 100um

Strong adaptability

1.Have the ability of laser cutting, drilling, slotting, marking and other fine processing skills for plane & curved surface instruments 

2.Can machine alumina, zirconia, aluminum nitride, silicon nitride, diamond, sapphire, silicon, gallium arsenide and tungsten steel

3.Equipped with a self-developed direct drive mobile double drive precision movement platform, granite platform, aluminum alloy granite beam for selection

4.Provide the optional function, such as double station & Visual Positioning & automatic feeding and unloading system & dynamic monitoring etc.

5.Equipped with self-developed long & short focal length, sharp nozzle & flat nozzle fine laser cutting head

6.Equipped with modular material receiving and dust removal pipeline system

7.Provide self-developed movable tension frame & fixed tension frame & vacuum adsorption & honeycomb plate, etc. optional fixture

8.Equipped with the self-developed 2D & 2.5D & 3D CAM software system for laser micromachining

Flexible design

1.Follow the design concept of ergonomics, delicate and concise

2.Flexible software & hardware function collocation, supporting personalized function configuration & intelligent production management

3.Support positive innovation design from component level to system level

4.Open control & laser micromachining software system easy to operate & intuitive interface

Technical certification

օ CE

օ ISO9001                     

օIATF16949


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