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Medical device solutions

Endoscopic bending section laser processing center

Short Description:

Endoscope bending section laser processing center is mainly used for anorectal endoscope, common bile duct endoscope, urinary endoscope, gastrointestinal endoscope and other medical endoscopes, electronic endoscope bending section laser micromachining

  • Small cutting seam width: 15 ~ 30um
  • High machining accuracy: ≤±10um
  • Good quality of incision: No rough edges, smooth incision
  • High processing efficiency: one - time cutting through the side wall, continuous automatic feed processing
  • Product Detail

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