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  • UV Laser Cutting Machine

UV Laser Cutting Machine

Short Description:

Ultraviolet laser cutting machine is mainly used for precision laser micromachining such as laser cutting, drilling, scribing, blind engraving, etc. of curved or flat surfaces such as PCB boards, cameras, and fingerprint recognition modules.


  • Small cutting seam width: 15 ~ 30um
  • High machining accuracy: ≤±15um
  • Good quality of incision: smooth incision, small heat affected zone, less burr and edge chipping
  • Size refinement: the minimum product size is 20um

    • Product Detail

    UV laser cutting machine
    Ultraviolet laser cutting machine is mainly used for PCB laser segmentation and drilling, camera, fingerprint recognition module FPC cutting, window opening of cover film of soft and hard board, uncovering and trimming, silicon steel sheet, ceramic sheet scribing, ultra-thin composite materials and Copper foil, aluminum foil &, carbon fiber, glass fiber, Pet, PI and other laser cutting processing. Common such as copper foil antenna cutting and forming, PCB board cutting and forming, FPC cutting and forming, glass fiber cutting and forming, film cutting and forming, gold-plated probe forming, etc.

    Technical Parameters:

    Maximum operating speed 500mm/s（X）；500mm/s（Y1Y2）；50mm/s（Z）；
    Positioning accuracy ±3um（X）±3um（Y1Y2）；±3um（Z）；
    1Repetitive positioning accurac ±1um（X）；±1um（Y1Y2）；±1um（Z）；
    1Machining material FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic and other materials
    Material wall thickness 0~1.0±0.02mm；
    Plane machining range 400mm*350mm；
    Laser type UV fiber laser;
    1Laser wavelength 355±5nm；
    1Laser power Nanosecond & picosecond，10W & 15W for option
    1Laser frequency 10~300KHz
    1Power stability < ± 3% (continuous operation for 12 hours);
    1Power supply 220V±10%,50Hz/60Hz；AC 20A(main circuit breaker)
    1File format DXF、DWG&Gebar；
    Dimensions 1200mm*1400mm*1800mm ；
    Equipment weight 1500Kg；

    Sample Exhibition:

    image10

    Application scope
    PCB laser splitting & drilling; Camera & fingerprint identification module FPC cutting; Covering film windowing & uncovering and trimming of hard and soft bonding plate; Silicon steel sheet & Ceramic Scribing; Ultra thin composite material & copper foil & aluminum foil & carbon fiber & glass fiber & Pet & PI laser cutting machining.

    High precision machining
    օ Small cutting seam width: 15 ~ 35um
    օ High machining accuracy ≤ 10um
    օ Good quality of incision: smooth incision & small heat affected zone & less burr
    օ Size refinement: minimum product size 50um

    Strong adaptability
    օ Have the ability of laser cutting, drilling, scribing, blind engraving and other fine machining technology for plane & regular curved surface instruments
    օ Can machine FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic and other materials
    օ Provide self-developed direct drive XY superposition type & split type fixed gantry precision motion platform & automatic loading and unloading system for option
    օ Provide the function of pre scan of bilateral CCD vision location & automatic target grasping and location
    օ Equipped with precision vacuum adsorption fixture & dust removal pipeline system
    օ Equipped with self-developed 2D & 2.5D CAM software system for laser micromachining

    Flexible design
    օ Follow the design concept of ergonomics, it is exquisite and concise
    օ The combination of software and hardware functions is flexible, supporting personalized function configuration and intelligent production management
    օ Support positive & innovative design from component level to system level
    օ Open type control, laser micro-machining software system, easy to operate & intuitive interface

    Technical certification
    օ CE
    օ ISO9001
    օ IATF16949

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