With the rapid development of the global consumer electronics industry, consumer electronics products are upgrading towards high integration and high precision. The internal components of electronic products are becoming smaller and smaller, and the requirements for precision and electronic integration are becoming higher and higher. The development of advanced laser manufacturing technology has brought solutions to the precision processing needs of the electronic industry. Taking the production process of mobile phones as an example, laser processing technology has penetrated into screen cutting, camera lens cutting, logo marking, internal component welding and other applications. At the “2019 Seminar on the application of laser advanced manufacturing technology in the industry”, scientific and technical experts from Tsinghua University and the Shanghai Institute of Optics and mechanics of the Chinese Academy of Sciences conducted an in-depth discussion on the current application of laser advanced manufacturing in the precision processing of consumer electronic products.
Now let me take you to analyze the six applications of ultrafast laser in precision processing of consumer electronics industry:
1.Ultra fast laser ultra-fine special manufacturing: ultra fast laser micro nano processing is an ultra-fine special manufacturing technology, which can process special materials to achieve special structures and specific optical, electrical, mechanical and other properties. Although this technology can no longer rely on materials to make tools, it widens the types of processed materials, and has the advantages of no wear and deformation. At the same time, there are also problems to be solved and improved, such as energy delivery and utilization efficiency, laser power and absorption wavelength selection, spatial accuracy of delivery, tool modeling, processing efficiency and accuracy. "Professor sunhongbo of Tsinghua University believes that laser manufacturing is still dominated by special tools, and macro and micro nano manufacturing perform their respective duties. In the future, ultrafast laser special fine manufacturing has great development potential in the direction of organic flexible electronics, space optical components and template transfer, quantum chips and nano robots. The future development direction of ultrafast laser manufacturing will be high-tech, high additional products, and strive to find a breakthrough in the industry."
2.Hundred watt ultrafast fiber lasers and their applications: in recent years, ultrafast fiber lasers have been widely used in consumer electronics, new energy, semiconductors, medical and other fields with their unique processing effects. It includes the application of ultrafast fiber laser in fine micromachining fields such as flexible circuit board, OLED display, PCB board, anisotropic cutting of mobile phone screen, etc. The ultrafast laser market is one of the fastest growing markets in the existing laser field. It is estimated that the total market volume of ultrafast laser will exceed 2billion US dollars by 2020. At present, the mainstream of the market is ultrafast solid-state lasers, but with the increase of the pulse energy of ultrafast fiber lasers, the share of ultrafast fiber lasers will increase significantly. The emergence of high average power ultrafast fiber lasers greater than 150 W will accelerate the market expansion of ultrafast lasers, and 1000 W and MJ femtosecond lasers will gradually enter the market.
3.The application of ultrafast laser in glass processing: the development of 5g technology and the rapid growth of terminal demand promote the development of semiconductor devices and packaging technology, and put forward higher requirements for the efficiency and accuracy of glass processing. Ultrafast laser processing technology can solve the above problems and become a high-quality choice for glass processing in the 5g era.
4.Application of laser precision cutting in the electronic industry: high performance fiber laser can carry out high-speed and high-precision laser cutting, drilling and other laser micro machining according to the design graphics of precision thin-walled metal equal diameter pipe and special-shaped pipe, as well as precision plane cutting of small format. The latter is a high-speed and high-precision laser micromachining equipment specialized in precision plane thin-walled instruments, which can process stainless steel, aluminum alloy, copper alloy, tungsten, molybdenum, lithium, magnesium aluminum alloy, ceramics and other plane materials commonly used in the field of electronic instruments.
5.Application of ultrafast laser in the processing of special-shaped screen: iphonex has opened a new trend of comprehensive special-shaped screen, and also promoted the continuous progress and development of special-shaped screen cutting technology. Zhu Jian, manager of Han's laser vision and semiconductor business department, introduced Han's independently developed icicles diffraction free beam technology. The technology adopts an original optical system, which can make the energy evenly distributed and ensure the consistent quality of the cutting section; Adopt automatic splitting scheme; After the LCD screen is cut, there is no particle splash on the surface, and the cutting accuracy is high (<20 μ m) Low heat effect (<50 μ m) And other advantages. This technology is suitable for sub mirror processing, thin glass cutting, LCD screen drilling, vehicle glass cutting and other fields.
6.Technology and application of laser printing conductive circuits on the surface of ceramic materials: ceramic materials have many advantages, such as high thermal conductivity, low dielectric constant, strong mechanical properties, good insulation performance and so on. They have gradually developed into an ideal packaging substrate for the new generation of integrated circuits, semiconductor module circuits and power electronic modules. Ceramic circuit board packaging technology has also been widely concerned and developed rapidly. The existing ceramic circuit board manufacturing technology has some shortcomings, such as expensive equipment, long production cycle, insufficient versatility of substrate, which limits the development of related technologies and devices. Therefore, the development of ceramic circuit board manufacturing technology and equipment with independent intellectual property rights is of great significance to improve China's technical level and core competitiveness in the field of electronic manufacturing.
Post time: Jul-08-2022