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EPLC6080 Precision Optical Fiber Laser Cutting Machine for PCB substrate Featured Image
  • EPLC6080 Precision Optical Fiber Laser Cutting Machine for PCB substrate

EPLC6080 Precision Optical Fiber Laser Cutting Machine for PCB substrate

Short Description:

PCB substrate precision fiber laser cutting machine is mainly used for laser microprocessing such as cutting, drilling, slotting, marking and other PCB aluminum substrates, copper substrates, and ceramic substrates.


  • Small cutting seam width : 20 ~ 40um
  • High machining accuracy : ≤±10um
  • Good quality of incision: smooth incision, small heat affected zone, less burr and edge chipping
  • Size refinement: the minimum product size is 20um

    • Product Detail

    PCB Substrate Precision Fiber Laser Cutting Machine

    PCB substrate precision fiber laser cutting machine is mainly used for laser microprocessing such as laser cutting, drilling and scribing of various PCB substrates, which can be referred to as PCB laser cutting machine for short. Such as PCB aluminum substrate cutting and forming, copper substrate cutting and forming, ceramic substrate cutting and forming, tinned copper substrate laser forming, chip cutting and forming, etc.

    Technical Parameters:

     Maximum operating speed 1000mm/s(X) ；1000mm/s(Yl&Y2) ；50mm/s(Z)；
    Positioning accuracy ±3um (X) ±3um (Y1&Y2) ；±5um (Z)；
    Repetitive positioning accuracy ±lum (X) ；±lum(Y1&Y2) ；±3um（Z）；
    Machining material precision stainless steel, hard alloy steel and other materials before or after surface treatment
    Material wall thickness 0~2.0±0.02mm；
    Plane machining range 600mm*800mm；(support customization for larger format requirements)
    Laser type Fiber laser;
    Laser wavelength 1030-1070±10nm；
    laser power CW1000W&CW2000W&QCW150W&QCW450W&QCW750W for option;
    Equipment power supply 220V± 10%, 50Hz；AC 30A (main circuit breaker);
    File format DXF、DWG；
    Equipment dimensions 1750mm*1850mm*1600mm；
    Equipment weight 1800Kg；

    Sample Exhibition:

    image7

    Application scope
    Laser micromachining of plane and curved surface instruments of precision stainless steel and hard alloy before or after surface treatment

    High precision machining
    օ Small cutting seam width: 20 ~ 40um
    օ High machining accuracy: ≤ ± 10um
    օ Good quality of incision: smooth incision & small heat affected zone & less burr
    օ Size refinement: the minimum product size is 100um

    Strong adaptability
    օ Have the ability of laser cutting, drilling, marking and other fine machining of PCB substrate
    օ Can machine PCB aluminum substrate, copper substrate, ceramic substrate and other materials
    օ Equipped with self-developed direct-drive mobile dual-drive precision motion platform, granite platform & sealed shafting configuration
    օ Provides dual position & visual positioning & automatic loading and unloading system & other optional functions
    օ Equipped with self-developed long & short focal length sharp nozzle & flat nozzle laser cutting head օ Equipped with customized vacuum adsorption clamping fixture & slag dust separation collection module & dust removal pipeline system & safety explosion-proof treatment system
    օ Equipped with self-developed 2D & 2.5D & CAM software system for laser micromachining

    Flexible design
    օ Follow the design concept of ergonomics, delicate and concise
    օ Flexible software & hardware function collocation, supporting personalized function configuration & intelligent production management
    օ Support positive innovation design from component level to system level
    օ Open control & laser micromachining software system easy to operate & intuitive interface

    Technical certification
    օ CE
    օ ISO9001
    օ IATF16949

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